Adhetron EP 2669
Thermally Conductive Epoxy Resin
EP2669 is a high performance electrical insulating, thermally conductive epoxy adhesive, potting and encapsulation compound. A combination of excellent characteristics of thermal conductivity and low coefficient expansion.
EP2669 is a two component room temperature cure system which has an advantage about storage, shipping and curing for heat sensitive components against one component systems. Typical applications are; heat sink bonding, casting of magnetic coils, encapsulation of heat emitting components, transformers and all kind of heat sensitive application.
Properties
- Thermally conductive
- Low temperature applications
- Long pot-life
| Base |
Color |
Cure Type |
| 2 Part Epoxy |
Black |
Room Temperature |
Typical Applications
- Potting and encapsulation of electronics
- Heat-sink bonding
- Casting of magnetic coils
- Heat sensitive bonding, potting, encapsulation applications
