Adhetron EP 5087
Thermally Conductive Structural Epoxy Adhesive
EP5087 is a two-component fast curing thermally conductive adhesive, sealant and potting compound. It is designed to deploy heat in electronic applications, with a measured thermal conductivity of 1.5 W/mK. Suitable for metal, plastics, ceramics and ferrite bonding applications.
Properties
- Thermally Conductive
- Fast curing
- 1:1 easy mix
| Base |
Color |
Cure Type |
| Epoxy |
Gray |
Room Temperature |
Typical Applications
- Bonding metals, plastics, ceramics, ferrite and more
- Suitable for potting applications
